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LastUpdate Última actualización 14/03/2026 [06:56:00]
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Solicitudes publicadas en los últimos 60 días / Applications published in the last 60 days
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A raman probe and apparatus and method for non-invasive in vivo measurement of analyte presence or concentration

NºPublicación:  GB2700315A 14/01/2026
Solicitante: 
RSP SYSTEMS AS [DK]
RSP Systems A/S
US_2024003741_PA

Resumen de: GB2700315A

A non-invasive in vivo measurement by Raman spectroscopy of an analyte (e.g. glucose) present in the skin of a subject (e.g. in the interstitial fluid). A controllable vertical-cavity surface-emitting laser (VCSEL) source 32, spatially separated from a detector 30, irradiates the skin 33 of the subject. The VSCELs selectively change the wavelength of light in using SWEPT methodologies. A bandpass filter receives Raman scattered radiation transmitted from the sample and a processor generates a Raman spectrum from the received Raman scattered radiation. The VCSELs may be distributed around the detector. The light sources 151 may be included in a generally planar probe (e.g. provided on a PCB) integrated with a spectrometer for miniaturisation. The probe may include a slit plate 146 having a slit 148 around which the light sources are arranged. The arrangement may provide spatially offset Raman spectroscopy (SORS). Figs 3&19A

CONTINUOUS BLOOD SUGAR MEASURING SENSOR MEMBER

Nº publicación: EP4678094A2 14/01/2026

Solicitante:

I SENS INC [KR]
I-SENS, INC

EP_4678094_A2

Resumen de: EP4678094A2

The present disclosure relates to a continuous blood sugar measuring sensor member, wherein: since an electrode layer formed on one surface of a substrate is connected to a sensor contact point part on the other surface of the substrate through a via hole and thus two electrode layers may be formed on different opposite surfaces without having to be formed on the same surface of the substrate, the width of the substrate may be further reduced and an overall minimized and simplified structure may be ensured; since an electrode connection layer formed at the via hole is not formed in a shape of filling the via hole but is formed only on the inner circumferential surface, a filling defect occurring in a process of filling the via hole and a fault in electrical connection according thereto may be prevented and thus a more stable structure may be ensured; and since a plurality of via holes are formed, despite damage to or the occurrence of a defect in an electrode connection layer formed at one of the via holes, electrical connection is maintained by electrode connection layers formed at the remaining via holes, and thus more stable performance may be maintained.

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