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Resultados 29 resultados
LastUpdate Última actualización 10/04/2026 [14:24:00]
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Solicitudes publicadas en los últimos 30 días / Applications published in the last 30 days (Publicaciones Chinas excluidas /Chinese publications excluded).
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COPPER FINE PARTICLE DISPERSION

NºPublicación:  WO2026053891A1 12/03/2026
Solicitante: 
KAO CORP [JP]
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WO_2026053891_A1

Resumen de: WO2026053891A1

One embodiment of the present invention relates to a copper fine particle dispersion. The copper fine particle dispersion includes copper fine particles A and a dispersion medium C. The dispersion medium C content is 3-40 mass%, and the dispersion medium C includes a dispersion medium C1 that has a boiling point of 200-270°C and a dispersion medium C2 that has a boiling point greater than 270°C. The mass ratio C1/C2 of the dispersion medium C1 with respect to the dispersion medium C2 is greater than 1. The dispersion medium C2 content in the dispersion medium C is 10-48 mass%. The copper fine particles A are preferably at least one type selected from copper nanoparticles A1 and copper microparticles A2. The copper nanoparticles A1 are preferably obtained by dispersion using a dispersion medium B. The average particle size of the copper nanoparticles A1 is preferably 105-270 nm.

Lead Frame Comprising a Discontinuous Surface Coating to Improve Capacitor Life

NºPublicación:  US20260074123A1 12/03/2026
Solicitante: 
KEMET ELECTRONICS CORP [US]
KEMET Electronics Corporation
US_20260074123_PA

Resumen de: US20260074123A1

Provided is a capacitor and method of forming the capacitor. The capacitor comprises a first capacitive couple comprising a first dielectric on a first anode and a first cathode on the first dielectric. The first anode and first cathode are connected to a lead frame comprising a discontinuous surface coating wherein the discontinuous surface coating comprises a contact region and a discontinuous region. At least one of the first anode or the first cathode is in electrical contact at the contact region. An encapsulant is in contact with the lead frame at the discontinuous region.

半導体粘着用フィルム

NºPublicación:  JP2026508542A 11/03/2026
Solicitante: 
ユルチョン・ケミカル・カンパニー・リミテッド
JP_2026508542_PA

Resumen de: EP1000000A1

The invention relates to an apparatus (1) for manufacturing green bricks from clay for the brick manufacturing industry, comprising a circulating conveyor (3) carrying mould containers combined to mould container parts (4), a reservoir (5) for clay arranged above the mould containers, means for carrying clay out of the reservoir (5) into the mould containers, means (9) for pressing and trimming clay in the mould containers, means (11) for supplying and placing take-off plates for the green bricks (13) and means for discharging green bricks released from the mould containers, characterized in that the apparatus further comprises means (22) for moving the mould container parts (4) filled with green bricks such that a protruding edge is formed on at least one side of the green bricks.

ANTENNAS COMPRISING MX-ENE FILMS AND COMPOSITES

Nº publicación: EP4708570A2 11/03/2026

Solicitante:

UNIV DREXEL [US]

EP_4708570_A2

Resumen de: EP4708570A2

0001 The present disclosure is directed to antennas for transmitting and/or receiving electrical signals comprising a MXene composition, devices comprising these antennas, and methods of transmitting and receiving signals using these antennas.

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